Space oven

ABSTRACT

A space oven operates in microgravity environments by forcing convection towards the center through a unique heating element and airflow design. The space oven includes a tubular chamber, a heating rack, a heating system, a cooling system, a hatch, a user interface, a microcontroller, an enclosure, at least one first vent, at least one second vent and at least one temperature sensor. The tubular chamber is the cooking area. The heating rack holds consumables in place. The heating system heats up consumables. The cooling system prevents any overheating. The hatch closes off and allows access to the inside of the tubular chamber. The user interface allows a user to input commands. The microcontroller manages the electronic components. The enclosure protects the tubular chamber. The at least one first vent and the at least one second vent reduce pressure buildup. The at least one temperature sensor monitors the internal temperature.

The current application claims a priority to the U.S. Provisional Pat.Application Serial No. 62/901,133 filed on Sep. 16, 2019.

FIELD OF THE INVENTION

The present invention generally relates to cooking appliances andmicrogravity utility devices. More specifically, the present inventionprovides a space oven intended to test how food items cook inmicrogravity environments.

BACKGROUND OF THE INVENTION

An objective of the present invention is to provide an oven which isused to evaluate cooking in a zero-gravity environment. The lack ofnatural convection exceeding touch-safe temperature, and the limitedfood position control in zero gravity relative to oven-heating elementshave restricted the use of conventional oven technology in space. Thespace oven of the present invention is provided as a stand-alone unitwith all components pre-installed within an Express Rack Locker Insertwithout a door. A Velcro-on front cover panel is provided during cookingoperations and cooldown to direct air flow across the oven and into thecooling rack area to cool sample trays. Further, the front cover panelencloses sample trays in the cooling rack from exceeding touchtemperatures when the space oven is unattended. The space oven is alsoexternally powered and monitored. A digital display screen for internaloven temperature monitoring with menu controls is provided on an airflowplenum.

The space oven provides restraint guiderails designed to providecontrolled movement of the sample tray in and out of the oven andpreclude contact with the heating elements or standoffs. Separate manualMaster Power and Heater Power switches are provided to allow tests,diagnostics, or updates to the control system without powering theheating element. The heating element is sized so a worst-case interioroven temperature of 363° F. (° F) is reached after two hours due toAerogel insulation properties and continuous 28 Volts direct current(DC) power to the heating element provided from the EXPRESS Rack powersupply. A door switch cuts power to the heating element and provides asignal to the controller if the oven door is not closed properly anddisplays a “DOOR OPEN” warning message on the liquid crystal display(LCD) screen. In addition, the fan controller cuts power to the heatingelement in event of fan failure/degradation. The present inventionincludes two independent resistance temperature detectors (RTDs) tomeasure the oven temperature and provide feedback to the controller tomaintain normal operating temperature. Further, an overheat switch thatcuts power to the heating element is provided which signals to thecontroller when the oven reaches a temperature of 392° F. (200° C.),triggers a light-emitting diode (LED) light, and displays an “OVERHEAT”warning message on the LCD screen.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of the present invention with theinternational-standard payload rack.

FIG. 2 is a top perspective view of the present invention with the topof the enclosure being exposed.

FIG. 3 is a top view of the present invention with the top of theenclosure being exposed and wherein the dashed arrows represent thefirst airflow path and the second airflow path.

FIG. 4 is an exploded perspective view displaying the hatch detachedfrom the tubular chamber.

FIG. 5 is a front view of the tubular chamber with the hatch attached.

FIG. 6 is a cross-section view taken along line 6-6 from FIG. 5 whereinthe dashed line represents the at least one heating wire.

FIG. 7 is a left-side view of the tubular chamber with the hatchattached.

FIG. 8 is a cross-section view taken along line 8-8 from FIG. 7 .

FIG. 9A is a top perspective view of the heating tray.

FIG. 9B is a bottom perspective view of the heating tray.

FIG. 10 is a schematic diagram illustrating the electronic connectionsof the present invention.

FIG. 11 is a schematic diagram illustrating the electrical connectionsof the present invention.

DETAIL DESCRIPTIONS OF THE INVENTION

All illustrations of the drawings are for the purpose of describingselected versions of the present invention and are not intended to limitthe scope of the present invention.

In reference to FIGS. 1 through 11 , the present invention is a spaceoven intended to test how food items cook in microgravity environments.In further detail, the present invention provides an oven that canoperate in microgravity environments by forcing convection towards thecenter of a cooking chamber through a unique heating element arrangementand airflow design. A preferred embodiment of the present inventioncomprises a tubular chamber 1, a heating rack 6, a heating system 9, acooling system 13, a hatch 17, a user interface 18, a microcontroller19, an enclosure 20, at least one first vent 24, at least one secondvent 25, and at least one temperature sensor 26. The tubular chamber 1is the cooking area of the present invention. The heating rack 6 is usedto hold consumables in place within the tubular chamber 1. The heatingsystem 9 provides heat in order to cook consumables placed within thetubular chamber 1. The cooling system 13 prevents the present inventionfrom overheating. The hatch 17 provides a means to close off and accessthe inside of the tubular chamber 1. The user interface 18 allows a userto input commands in order to heat up consumables. The microcontroller19 controls and manages the electronic components of the presentinvention. The enclosure 20 protects the tubular chamber 1 and isdesigned to establish a unique airflow. The at least one first vent 24and the at least one second vent 25 prevent the tubular chamber 1 frombeing a closed system and reduce pressure buildup within the tubularchamber 1. The at least one temperature sensor 26 monitors thetemperature within the tubular chamber 1.

The general configuration of the aforementioned components allows thepresent invention to operate in microgravity environments by forcingconvection towards the center of the tubular chamber 1 through a uniqueheating element arrangement and airflow design. With reference to FIG. 4, the tubular chamber 1 comprises an open chamber end 2 and a closedchamber end 3. The tubular chamber 1 is preferably a double walledcylindrical chamber machined form aluminum and stainless steel. Withreference to FIGS. 6 and 8 , the heating rack 6 is mounted within thetubular chamber 1 and is centrally positioned along the tubular chamber1. In further detail, the heating rack 6 is preferably mounted through aset of angled mounting hole. Further, this arrangement prevents theheating rack 6 from rotating within the tubular chamber 1 and allows theheating rack 6 to receive optimal heat from the heating system 9. Theheating system 9 is also mounted within tubular chamber 1 and isdistributed around the heating rack 6. In further detail, the heatingsystem 9 is preferably mounted through a set of fasteners which arepositioned around the heating rack 6. This arrangement distributes heattowards the center of the tubular chamber 1, and therefore, heating isapplied to all sides of the heating rack 6. Moreover, standardconditions, air near the inner lateral surface of the tubular chamber 1would transfer heat to the outer lateral surface of the tubular chamber1, and that heat will be conducted away to the exterior of the presentinvention and lost to the environment. However, the arrangement of theheating rack 6, the heating system 9, and the tubular chamber 1 mustaccommodate for the lack of convection in microgravity. In microgravityconditions, the low thermal conductivity of air will limit the heat fromflowing from the pocket of hot air at the center of the tubular chamber1 to the lateral surface of the tubular chamber 1. Thus, thisarrangement allows consumables, placed within the tubular chamber 1, tobe exposed to cooking temperatures, while the lateral surface of thetubular chamber 1 remains relatively cool and safe to touch.

In addition and with reference to FIGS. 2 through 4 , the hatch 17 isoperatively mounted to the open chamber end 2. The hatch 17 is used toselectively access the open chamber end 2. In further detail, the hatch17 includes a matching hollow design with a center opening to receive atemperature gauge. The hatch 17 is preferably mounted to the openchamber end 2 with a plurality of O-rings provided in between to sealthe connection. Further, the hatch 17 may include a handle to facilitatethe safe opening and closing of the hatch 17. With reference to FIG. 6 ,the at least one first vent 24 is integrated into the hatch 17. Infurther detail, the at least one first vent 24 is preferably aninstallation vent that traverses through the hatch 17 in order toprevent pressure buildup during operation of the present invention.Similarly, the at least one second vent 25 is integrated into the closedchamber end 3. The at least one second vent 25 is preferably aninstallation vent, which is more specifically a 40-micron porousstainless-steel vent. The installation vent of the at least one firstvent 24 and the installation vent of the at least one second vent 25work together to provide a continuous vent design. Therefore, nocracking pressure is required to active the present invention. Further,the 40-micron porous stainless-steel vent of the at least one secondvent 25 releases pressure from the tubular chamber 1 when gases expandedduring operation of the present invention.

Moreover and with reference to FIGS. 3 and 10 , the tubular chamber 1,the microcontroller 19, and the user interface 18 are mounted within theenclosure 20. Thus, the tubular chamber 1, the microcontroller 19, andthe user interface 18 are protected by the enclosure 20 and held inplace within the enclosure 20. In further detail, the tubular chamber 1is preferably mounted within the enclosure 20 through at least onefastening bracket. The cooling system 13 is integrated into theenclosure 20. In further detail, the cooling system 13 traverses throughthe backend of the enclosure 20 to direct cool air into the enclosure 20while simultaneously pulling hot air out of the enclosure 20. The atleast one temperature sensor 26 is mounted into the closed chamber end3. In further detail, the at least one temperature sensor 26 ispreferably mounted through a hole in the closed chamber end 3 by a setof fasteners. Moreover, this arrangement is sealed with ahigh-temperature room temperature vulcanizing (RTV) sealant.

Furthermore and with reference to FIG. 10 , the microcontroller 19 iselectronically connected to the heating system 9, the cooling system 13,the user interface 18, and the at least one temperature sensor 26. Thus,the microcontroller 19 can manage and control the heating system 9, thecooling system 13, the user interface 18, and the at least onetemperature sensor 26. The microcontroller 19 is preferably an AT Mega32U4 microcontroller 19. The user interface 18 can be any type of userinterface 18 such as, but not limited to, a touch-screen display screenor a liquid crystal display (LCD) screen with a plurality of controlbuttons. Inputs from the user interface 18 are monitored by themicrocontroller 19, and a context dependent menu is displayed on theuser interface 18. Nominal operation of the present invention beginswith turning on the “Master Power” and “Heater Power” switches of theuser interface 18. The LCD screen of the user interface 18 shows acontext dependent menu that allows the operator to use the threepushbuttons of the user interface 18 to cycle through and selectoptions. A user can select a “Preheat” temperature, or a “Cook”temperature and cooking time, or enter an options menu to change ovensettings. Oven temperature can be set in 5-degree increments, and timecan be set in one-minute increments. Once an oven temperature is set bythe user, the microcontroller 19 operates as a two-state controller tocycle the heating system 9 on and off to maintain the internaltemperature of the tubular chamber 1. A ±3° hysteresis is built into thecontrol program to prevent the microcontroller 19 from switching at highfrequency when the present invention reaches its set temperature. Themicrocontroller 19 monitors the internal temperature of the tubularchamber 1 via the at least one temperature sensor 26 which preferablyincludes a set of platinum resistive temperature devices (RTDs) andcontrols a solid-state relay (SSR) to apply power to the heating system9. The at least one temperature sensor 26 may also include an automatedshutoff thermostat that automatically disables the heating system 9 if ahigh-temperature threshold is reached. The microcontroller 19 monitorsand manages the air temperature in the enclosure 20 around the userinterface 18 and the tubular chamber 1 by the cooling system 13.

With reference to FIG. 6 , the present invention may further comprise aquantity of insulation material 27 in order to prevent the release ofheat from the inside of the tubular chamber 1. As mentioned previously,the tubular chamber 1 is preferably a double-walled cylindrical chamberand, thus, comprises an inner lateral wall 4 and an outer lateral wall5. The inner lateral wall 4 is concentrically encircled by the outerlateral wall 5. The quantity of insulation material 27 is preferablycompressed granulated Aerogel insulation and is positioned between theinner lateral wall 4 and the outer lateral wall 5. Thus, thisarrangement prevents the release of heat from the inside of the presentinvention. Similarly, the hatch 17 may also be doubled-walled like thetubular chamber 1 and filled with the same insulation.

In order for the heating system 9 to effectively distribute heat towardsthe center of the tubular chamber 1 and with reference to FIG. 6 , theheating system 9 comprises a plurality of first standoffs 10, aplurality of second standoffs 11, and at least one heating wire 12. Theplurality of first standoffs 10 is mounted adjacent to the open chamberend 2. In further detail, the plurality of first standoffs 10 ispreferably a set of ceramic standoffs that are recessed into aluminumbosses and encapsulated with a high-temperature RTV sealant to preventdebris from being released into a space station environment in case ofaccidental shattering of the ceramic material. Fasteners such asstainless-steel screws are mounted in each of the plurality of firststandoffs 10. Similarly, the plurality of second standoffs 11 is mountedadjacent to the closed chamber end 3. In further detail, the pluralityof second standoffs 11 is preferably a set of ceramic standoffs that arerecessed into aluminum housings and encapsulated with a high-temperatureRTV sealant to prevent debris from being released into a space stationenvironment in case of accidental shattering of the ceramic material.Fasteners such as stainless-steel screws are mounted in each of theplurality of second standoffs 11. The fastener of the plurality of firststandoffs 10 and the fasteners of the plurality of second standoffs 11provide electrically insulated mounting points for the at least oneheating wire 12. The at least one heating wire 12 is preferably anichrome 80 wire. The plurality of first standoffs 10 and the pluralityof second standoffs 11 are distributed around the heating rack 6, andthe at least one heating wire 12 is strung in between the plurality offirst standoffs 10 and the plurality of second standoffs 11. Thus, thisarrangement effectively distributes heat towards the center of thetubular chamber 1.

In order for the cooling system 13 to effectively prevent the presentinvention from overheating and with reference to FIG. 2 , the coolingsystem 13 comprises an inlet fan assembly 14, an outlet fan assembly 15,and a plurality of airflow-guiding panels 16. The inlet fan assembly 14and the outlet fan assembly 15 are positioned adjacent to the closedchamber end 3. In further detail, the inlet fan assembly 14 and theoutlet fan assembly 15 are preferably mounted into the backend of theenclosure 20. The inlet fan assembly 14 is positioned offset from theoutlet fan assembly 15. The inlet fan assembly 14 is in fluidcommunication with the outlet fan assembly 15 through the plurality ofairflow-guiding panels 16, the at least one first vent 24, and the atleast one second vent 25. In further detail, the inlet fan assembly 14directs cool air into the enclosure 20 through the air-flow guidingpanels 16, and the outlet fan assembly 15 pulls hot air out of theenclosure 20 while the at least one first vent 24 and the at least onesecond vent 25 slowly reduce pressure from the inside of the tubularchamber 1 by letting out gas. With reference to FIG. 3 , a first airflowpath is delineated from the inlet fan assembly 14, in between the openchamber end 2 and the closed chamber end 3 (i.e. about the lateralsurface of the tubular chamber 1) and to the outlet fan assembly 15. Thefirst airflow path provides a forced convection over the tubular chamber1. A second airflow path is delineated from the inlet fan assembly 14,across the hatch 17, and to the outlet fan assembly 15. The secondairflow path cools the user interface 18 and the microcontroller 19. Inthe preferred embodiment, the user interface 18 is mounted onto one ofthe plurality of airflow-guiding panels 16, and the microcontroller 19is mounted within the same airflow-guiding panel. Thus, the tubularchamber 1 and the electronic components of the present invention can becooled by the cooling system 13. The inlet fan assembly 14 and theoutlet fan assembly 15 may each include a fan controller that monitorsthe air temperature inside the enclosure 20 around the electroniccomponents of the present invention and the tubular chamber 1. The fancontroller reports fan failures or off-nominal temperature conditions tothe microcontroller 19.

With reference to FIGS. 2 and 3 , the present invention may furthercomprise at least one cooling rack 28 in order to allow consumables tocool after being heated by the present invention. The at least onecooling rack 28 is mounted within the enclosure 20 and is positionedadjacent to the open chamber end 2. In further detail, the at least onecooling rack 28 is preferably mounted in between two of the plurality ofairflow-guiding panels 16. The first airflow path and the second airflowpath are intersected by the at least one cooling rack 28. In furtherdetail, cool air is drawn into an inlet airflow-guiding panel from theplurality of airflow-guiding panels 16 by the inlet fan assembly 14 anddirected over the electronic components of the present invention. Thecool air is then directed by vents to flow over the tubular chamber 1,the hatch 17, and the at least one cooling rack 28.

With reference to FIG. 8 , the present invention may further comprise aheating tray 29 in order to safely heat consumables within the tubularchamber 1. The heating rack 6 comprises a first track 7 and a secondtrack 8. The first track 7 and the second track 8 are each preferably aset of stainless-steel tubing. The first track 7 and the second track 8traverse from the open chamber end 2 to the closed chamber end 3.Further, the first track 7 and the second track 8 are positionedopposite to each other within the tubular chamber 1. This arrangementprevents consumables, placed on the heating rack 6, from rotating withinthe tubular chamber 1. The heating tray 29 is slidably engaged inbetween the first track 7 and the second track 8. Thus, the heating tray29 is held in place by the heating rack 6.

In order for the heating rack 6 to safely seal consumables inpreparation to be heated by the present invention and with reference toFIGS. 9A and 9B, the heating tray 29 may further comprise a firstsealing assembly 30 and a second sealing assembly 31. The first sealingassembly 30 and the second sealing assembly 31 each comprise a flexiblesheet 32, a rigid frame 33, and a pressure-release valve 34. Theflexible sheet 32 is preferably a silicone sheet. The rigid frame 33 ispreferably a rectangular, aluminum frame. The pressure-release valve 34is preferably a 40-micron vent. The pressure-release valve 34 isintegrated into the flexible sheet 32. This arrangement preventspressure build within the heating tray 29. The rigid frame 33 isperimetrically connected around the flexible sheet 32. This arrangementallows the rigid frame 33 to border the flexible sheet 32. Further, therigid frame 33 of the first sealing assembly 30 is hermeticallyconnected to the rigid frame 33 of the second sealing assembly 31. Thisarrangement ensures an airtight seal for the heating tray 29 to packagecookable consumables. Moreover, the rigid frame 33 allows the heatingtray 29 to be slidably engaged in between the first track 7 and thesecond track 8.

In order for the enclosure 20 to protect the tubular chamber 1 and theelectronic components of the present invention while still allowingaccess to the tubular chamber 1 and the electronic components of thepresent invention and with reference to FIG. 1 , the enclosure 20comprises a receptacle 21 and a cover 23. The receptacle 21 comprises anopening 22. With reference to FIG. 2 , the open chamber end 2, the userinterface 18, and the microcontroller 19 are positioned adjacent to theopening 22. This arrangement allows a user to easily access the insideof the tubular chamber 1 and the user interface 18. Further, the coolingsystem 13 is positioned opposite to the opening 22 about the enclosure20. This allows the cooling system 13 to easily direct cool air into andpull hot air from the enclosure 20. The receptacle 21 is perimetricallyattached to the cover 23, and the cover 23 is positioned across theopening 22. The cover 23 can be perimetrically attached to the cover 23by any fastening mechanism but is preferably attached to the cover 23through a hook-and-loop fastener. Thus, the tubular chamber 1 and theuser interface 18 can be accessed by detaching the cover 23 from thereceptacle 21.

In order to provide a safety measure to the operation of the presentinvention and with reference to FIG. 10 , the present invention mayfurther comprise a door switch 35. The door switch 35 is operativelyintegrated in between the hatch 17 and the open chamber end 2. The doorswitch 35 is used to detect a closed configuration for the hatch 17 andan open configuration for the hatch 17. The microcontroller 19 iselectronically connected to the door switch 35. In further detail, thedoor switch 35 shuts off power to the heating system 9 when a user opensthe hatch 17 to insert or remove consumables or in case the hatch 17 isnot closed and secured properly.

In order for the microcontroller 19 to be monitored and updated and withreference to FIG. 10 , the present invention may further comprise acommunication computing device 36. The communication computing device 36is preferably a BeagleBone black single-board computer that monitors thepayload and provides an interface for ground controllers to interactwith the present invention. The communication computing device 36monitors the fan controllers for fan failures or off nominal temperatureconditions and records the plenum temperatures to a log file. Thecommunication computing device 36 is mounted within the enclosure 20 andis electronically connected to the microcontroller 19. This arrangementallows the communication computing device 36 to interface with themicrocontroller 19 and allows updates and new operational programs to beuploaded to the microcontroller 19.

In order for the present invention to communicate and receive electricalpower from a space station and with reference to FIGS. 10 and 11 , thepresent invention may further comprise a data port 37, a power port 38,and an international-standard payload rack 39. The data port 37 and thepower port 38 are integrated into the enclosure 20. In further detail,the data port 37 and the power port 38 are standard power and ethernetconnections for devices to interface with a space station. The enclosure20 is mounted into the international-standard payload rack 39 through aset of fasteners in order for the international-standard payload rack 39to protect and hold the enclosure 20 in place. Theinternational-standard payload rack 39 is electronically connected tothe communication computing device 36 by the data port 37. This allowsdata to be relayed between the present invention, through theinternational-standard payload rack 39, and a space station. Theinternational-standard payload rack 39 is electrically connected to theheating system 9, the cooling system 13, the user interface 18, themicrocontroller 19, the at least one temperature sensor 26, and thecommunication computing device 36 by the power port 38. This allows 28Volts direct current (DC) power to be supplied to the present inventionvia the international-standard payload rack 39. The electrical powerfrom the space station is conditioned by a power supply of the presentinvention to provide 28 Volts DC power to the heating system 9 and 5Volts DC power to the cooling system 13, the user interface 18, themicrocontroller 19, the at least one temperature sensor 26, and thecommunication computing device 36.

Although the invention has been explained in relation to its preferredembodiment, it is to be understood that many other possiblemodifications and variations can be made without departing from thespirit and scope of the invention as hereinafter claimed.

What is claimed is: 1-12. (canceled)
 13. A space oven for operation in amicro-gravity environment, comprising: a chamber that includes a firstend opposite a second end along a central axis; at least one heatingrack mounted within the chamber along the central axis; and at least oneheating wire that is fastened to a plurality of locations that aredistributed around the central axis and that alternate between the firstend and the second end, such that operating the at least one heatingwire in a micro-gravity environment causes heat to be conveyed towardthe central axis.
 14. The space oven of claim 13, further comprising: ateach of the plurality of locations, a respective standoff that offsetsthe at least one heating wire away from the first and second ends,respectively.
 15. The space oven of claim 14, wherein, in each case, therespective standoff is recessed into a boss and encapsulated with asealant.
 16. The space oven of claim 14, further comprising: arespective fastener that, in each case, mounts the at least one heatingwire to the respective standoff.
 17. The space oven of claim 13, whereinthe plurality of locations define electrically insulated mounting pointsfor the at least one heating wire.
 18. The space oven of claim 13,wherein: the first end includes an open end; and the space oven furthercomprises a hatch operatively mounted to the open end.
 19. The spaceoven of claim 13, further comprising: a heating tray that, in a closedposition, defines a hermetically sealed interior, and that is removablymountable in the chamber via the at least one heating rack.
 20. Thespace oven of claim 13, wherein the at least one heating wire isconfigured so as to inhibit heating of an interior surface of thechamber.
 21. A method of operating a space oven, comprising: insertingat least one heating tray into a chamber of the space oven via a firstend opposite a second end along a central axis, and removably mountingthe at least one heating tray in at least one heating rack mountedwithin the chamber along the central axis; and operating at least oneheating wire that is fastened to a plurality of locations that aredistributed around the central axis and that alternate between the firstend and the second end, such that heat is conveyed toward the centralaxis.
 22. The method of claim 21, wherein, at each of the plurality oflocations, a respective standoff offsets the at least one heating wireaway from the first and second ends, respectively.
 23. The method ofclaim 22, wherein, in each case, the respective standoff is recessedinto a boss and encapsulated with a sealant.
 24. The method of claim 22,wherein, in each case, a respective fastener mounts the at least oneheating wire to the respective standoff.
 25. The method of claim 21,wherein the plurality of locations define electrically insulatedmounting points for the at least one heating wire.
 26. The space oven ofclaim 21, wherein: the first end includes an open end; and the spaceoven further comprises a hatch operatively mounted to the open end. 27.The space oven of claim 21, further comprising: inserting at least oneitem to be heated into an interior of the at least one heating tray inan open position; and transitioning the at least one heating tray into aclosed position, such that the interior is hermetically sealed.
 28. Themethod of claim 21, wherein the at least one heating wire is configuredso as to inhibit heating of an interior surface of the chamber, suchthat the interior surface remains safe to human touch during operationof the at least one heating wire.
 29. A method of producing a spaceoven, comprising: mounting at least one heating rack within a chamber ofthe space oven along a central axis of the chamber that extends betweena first end and a second end opposite the first end; and fastening atleast one heating wire to a plurality of locations that are distributedaround the central axis and that alternate between the first end and thesecond end, such that operating the at least one heating wire in amicro-gravity environment causes heat to be conveyed toward the centralaxis.
 30. The method of claim 29, wherein fastening the at least oneheating wire to the plurality of locations includes: recessing arespective standoff into a boss at each of the plurality of locations;in each case, fastening the at least one heating wire to the respectivestandoff, such that the at least one heating wire is offset from thefirst and second ends, respectively, by the respective standoff; andencapsulating the respective standoff with a sealant.
 31. The method ofclaim 30, wherein: in each case, the at least one heating wire isfastened to the respective standoff via a respective fastener; and theplurality of locations define electrically insulated mounting points forthe at least one heating wire.
 32. The space oven of claim 29, whereinthe at least one heating wire is configured so as to inhibit heating ofan interior surface of the chamber.